Measurements taken from parts that are believed to have been leaked from Apple’s assembly line reveal that the iPhone 5 could be 18 per cent thinner than the iPhone 4S.
An article from the Chinese newspaper Apple Daily was scanned by Apple.pro, revealing the measurements taken from an alleged iPhone 5 enclosure.
Apple Daily recorded that the enclosure is 58.7mm wide, 123.83mm long and 7.6mm thick, and is about 18 per cent thinner than the iPhone 4S, at just 7.6mm thick. These dimensions match with previously leaked iPhone 5 drawings published by Mobile Fun.
Apple Insider reports that Apple could achieve a thinner iPhone by making it taller, moving the headphone jack to the bottom of the device, a smaller SIM tray to accommodate the new nano-SIM, and a smaller dock connector.
The iPhone 5 is expected to be revealed at a special event on 12 September. See: Everything we know about the next iPhone’s specifications, features, launch date.