Apple's iPhone 6 and 6 Plus have been cracked opened and stripped by repair site iFixit, which has revealed key specifications and repairing gripes.

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Head over to Apple's website and peruse the specs page of the latest iPhone 6 and 6 Plus. The tell-all page has some unusual omissions, including details on the battery and other processing components.

Fortunately repair site iFixit has disassembled a brand new iPhone 6 and 6 Plus.

Notes of specs in the iPhone 6 include 1GB of RAM and a 1810 milliamp-hour battery. The 6 Plus has the same 1GB RAM, but a much larger 2915 milliamp-hour battery.

Bigger batteries don't necessarily translate to better battery life. Both the iPhone 6 and 6 Plus have bigger screens with higher resolutions, which demand more power from the battery. For the sake of comparison, Apple's iPhone 5S has a 1560 milliamp-hour battery.

Apple use a custom A8 chipset with 64 bit architecture for the iPhone 6's processor. Reports claim the iPhone 6 has a 1.3GHz dual-core CPU, while 6 Plus runs a 1.4GHz dual-core CPU.

Most of the components used in the iPhone 6 range are manufactured by Qualcomm, Texas Instruments, Skyworks and Avago.

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Apple has made notable improvements to the assembly to its new range of iPhones, which should make repairing common faults easier.

Replacing the display assembly should be less difficult as it the first component to be removed. Swapping out the battery is relatively simple, but it does necessitate a proprietary pentalobe screw driver and know-how on removing some adhesive.

A common gripe with the iPhone 5S was the wiring affixed to the finger scanner. Prying the screen open of the iPhone 5S caused the wire to grow taut and, if opened carelessly, caused it to tear. Apple has improved this assembly by rerouting the cable.

The iPhone 6 and 6 Plus is considered a marked improvement for Apple smartphones and scored a respectable 7 out of 10 by iFixit. Holding the smartphone's repair rating back was the use of proprietary pentalobe screwdrivers and Apple's reluctance to share "repair information with independent repair shops or consumers".

Here's the full list of components based on iFixit's teardown:

Apple iPhone 6

Read more:Apple iPhone 6 hands-on

"Apple A8 APL1011 SoC + SK Hynix RAM as denoted by the markings H9CKNNN8KTMRWR-NTH (we presume it is 1 GB LPDDR3 RAM, the same as in the iPhone 6 Plus)"Qualcomm MDM9625M LTE Modem"Skyworks 77802-23 Low Band LTE PAD"Avago A8020 High Band PAD"Avago A8010 Ultra High Band PA + FBARs"SkyWorks 77803-20 Mid Band LTE PAD"InvenSense MP67B 6-axis Gyroscope and Accelerometer Combo"Qualcomm QFE1000 Envelope Tracking IC"RF Micro Devices RF5159 Antenna Switch Module"SkyWorks 77356-8 Mid Band PAD"SanDisk SDMFLBCB2 128 Gb (16 GB) NAND Flash"Murata 339S0228 Wi-Fi Module"Apple/Dialog 338S1251-AZ Power Management IC"Broadcom BCM5976 Touchscreen Controller"NXP LPC18B1UK ARM Cortex-M3 Microcontroller (also known as the M8 motion coprocessor)"NXP 65V10 NFC module + Secure Element (likely contains an NXP PN544 NFC controller inside)"Qualcomm WTR1625L RF Transceiver"Qualcomm WFR1620 receive-only companion chip. Qualcomm states that the WFR1620 is "required for implementation of carrier aggregation with WTR1625L.""Qualcomm PM8019 Power Management IC"Texas Instruments 343S0694 Touch Transmitter"AMS AS3923 NFC Booster IC designed to "improve performance of existing NFC controllers for challenging environments such as mobile and wearables" and also delivers "less restrictive antenna design requirements""Cirrus Logic 338S1201 Audio Codec

Apple iPhone 6 Plus

"Apple A8 APL1011 SoC + Elpida 1 GB LPDDR3 RAM (as denoted by the markings EDF8164A3PM-GD-F)"Qualcomm MDM9625M LTE Modem"Skyworks 77802-23 Low Band LTE PAD"Avago A8020 High Band PAD"Avago A8010 Ultra High Band PA + FBARs"TriQuint TQF6410 3G EDGE Power Amplifier Module"InvenSense MP67B 6-axis Gyroscope and Accelerometer Combo"Qualcomm QFE1000 Envelope Tracking IC"RF Micro Devices RF5159 Antenna Switch Module"SkyWorks 77356-8 Mid Band PAD"SK Hynix H2JTDG8UD1BMS 128 Gb (16 GB) NAND Flash"Murata 339S0228 Wi-Fi Module"Apple/Dialog 338S1251-AZ Power Management IC"Broadcom BCM5976 Touchscreen Controller"NXP LPC18B1UK ARM Cortex-M3 Microcontroller (also known as the M8 motion coprocessor)"NXP 65V10 NFC module + Secure Element (likely contains an NXP PN544 NFC controller inside)"Qualcomm WTR1625L RF Transceiver"Qualcomm WFR1620 receive-only companion chip. Qualcomm states that the WFR1620 is "required for implementation of carrier aggregation with WTR1625L.""Qualcomm PM8019 Power Management IC"Texas Instruments 343S0694 Touch Transmitter"AMS AS3923 NFC Booster IC"Cirrus Logic 338S1201 Audio Codec

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